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CHX3068-QDG
RoHS COMPLIANT
15-30GHz Frequency Multiplier
GaAs Monolithic Microwave IC in SMD leadless package
Description
The CHX3068-QDG is a Ka-band frequency multiplier monolithic integrated circuit. Typical applications are for telecommunication such as DVB-RCS. The circuit is manufactured with a pHEMT process, 0.25m gate length, via holes through the substrate, air bridges and electron beam gate lithography. It is supplied in lead-free SMD package
UMS 11971 YYWW
.
Main Features
14 to 15 GHz input frequency Input and output integrated buffers 20dBm output power Low input power: 0 to 5dBm DC bias 270mA @ 4V 24L-QFN4X4 SMD package
Pout (dBm) Pout_H2
Pout_H1 Pout_H3
Fin (GHz)
Main Characteristics
Tamb. = 25 Vd = 4.V typical consumption 270mA C, Symbol
Fin Fout Pin Pout
Parameter
Input frequency range Output frequency range Input power Output power
Min
14 28 0
Typ
Max
15 30 5
Unit
GHz GHz dBm dBm
20
ESD Protections: Electrostatic discharge sensitive device observe handling precautions!
Ref: DSCHX3068-QDG8144 - 23 May 08 1/8 Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Route Departementale 128 - BP46 - 91401 Orsay Cedex France Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
CHX3068-QDG
Electrical Characteristics
15-30GHz Frequency Multiplier
Tamb = +25 Vd0=Vd1,2=Vd3=Vd4= 4.V Consumption(I d0+Id1,2+Id3+Id4) 270mA (1) C, Symbol
Fin Fout Pin Pout_H2 Rej_H1 Rej_H3 VSWRin
Parameter
Input frequency range Output frequency range Input power Output power for +2 dBm input power Fundamental rejection for +2dBm input power Third harmonic rejection for +2dBm input power Input VSWR
Min
14 28 0
Typ
Max
15 30 5
Unit
GHz GHz dBm dBm dBc dBc
20 30 50 2.0:1 2.0:1 4 -1.8 270
VSWRout Output VSWR Vd Vg Id Drain voltage supply Gate voltage supply (1) Bias current (with RF)
V V mA
(1) Adjust Vg to achieve Id4=115 mA
These values are representative of onboard measurements as defined on the drawing at page 8 (paragprah "Evaluation mother board:").
Ref: DSCHX3068-QDG8144 - 23 May 08
2/8
Specifications subject to change without notice
Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
15-30GHz Frequency Multiplier
Absolute Maximum Ratings (1)
Tamb = +25 C Symbol
Vd Id Pin Tjmax Ta Tstg Drain bias voltage Drain bias current Maximum input power Maximum Junction Temperature Operating temperature range Storage temperature range
CHX3068-QDG
Parameter
Values
4.5 330 +8 175 -40 to +85 -55 to +125
Unit
V mA dBm C C C
(1) Operation of this device above anyone of these paramaters may cause permanent damage.
Device thermal performances:
All the figures given in this section are obtained assuming that the QFN device is cooled down only by conduction through the package thermal pad (no convection mode considered). The temperature is monitored at the package back-side interface (Tcase) as shown below. The system maximum temperature must be adjusted in order to guarantee that Tcase remains below than the maximum value specified in the next table. So, the system PCB must be designed to comply with this requirement. A derating must be applied on the dissipated power if the case temperature (Tcase) can not be maintained below the maximum temperature specified in order to guarantee the nominal device life time (MTTF) (see the curve Pdiss. Max).
DEVICE THERMAL SPECIFICATION : CHX3068-QDG Max. junction temperature (Tj max) : 155 C Max. continuous dissipated power @ Tcase= 85 : C 1.08 W (1) => Pdiss derating above Tcase = 85 : C 15 mW/ C (2) Junction-Case thermal resistance (Rth J-C) : <65 C/W (3) Min. package back side operating temperature : -40 C (3) Max. package back side operating temperature : 85 C Min. storage temperature : -55 C Max. storage temperature : 125 C
(1) Derating at junction temperature constant = Tj max. (2) Rth J-C is calculated for a worst case where the hotter junction of the MMIC is considered. (3) Tcase=Package back side temperature measured under the die-attach-pad (see the drawing below).
1.2 1 Pdiss. Max. (W) 0.8 0.6 0.4 Pdiss. Max. (W) 0.2 0 -50 -25 0 25 50 75 100 125 Tcase ( C)
Tcase
Example of QFN 16L 3x3 back-side view, temperature reference point (Tcase) location.
Ref:. DSCHX3068-QDG8144 - 23 May 08
3/8
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
CHX3068-QDG
15-30GHz Frequency Multiplier
Typical PCB Measured Performances
Tamb=+25 Vd0=Vd1,2=Vd3=Vd4=4V Vg for Id4=115mA ( -1.8V) C,
Second harmonic output power versus input frequency (Fin)
@ Pin=0 & 5dBm Pout H2 (dBm) 50 252 .0 202 .0 00 151 .0 50 101 .0 00 5 50 .0
.0 0 00
Pin=5dBm Pin=0dBm
14
14.25
14.5
14.75
15
Fin (GHz)
15.25
15.5
15.75
16
Fundamental rejection versus Fin
@ Pin=0 & 5dBm Rejection_H1 (dBc) 50 40 30 20 1 0 0 Pin=5dBm
Pin=0dBm
14
14.25
14.5
14.75
15
Fin (GHz)
15.25
15.5
15.75
16
3rd harmonic rejection versus Fin
@Pin=0 & 5dBm Rejection_H3 (dBc) 60 50 40 30 20 10 0 Pin=5dBm Pin=0dBm
14
14.25
14.5
14.75
15
Fin (GHz)
15.25
15.5
15.75
16
Ref: DSCHX3068-QDG8144 - 23 May 08
4/8
Specifications subject to change without notice
Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
15-30GHz Frequency Multiplier
Package outline (1):
CHX3068-QDG
11971
Matt tin, Free Units From standard
Lead
(Green) mm
123456789101112-
NC NC GND RF IN GND NC NC NC NC Vg NC NC
131415161718192021222324-
NC GND RF OUT GND NC NC Vd4 NC Vd3 Vd1, 2 Vd0 NC
the
JEDEC MO-220 (VGGD)
25- GND
(1)
The package outline drawing included to this data-sheet is given for indication. Refere to the application note AN0017 available at http://www.ums-gaas.com for exact package dimensions.
Ref:. DSCHX3068-QDG8144 - 23 May 08
5/8
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
CHX3068-QDG
Recommanded package footprint
15-30GHz Frequency Multiplier
Refere to the application note AN0017 available at http://www.ums-gaas.com for package foot print recommandations.
SMD mounting procedure
The SMD leadless package has been designed for high volume surface mount PCB assembly process. The dimensions and footprint required for the PCB (motherboard) are given in the drawings above. For the mounting process standard techniques involving solder paste and a suitable reflow process can be used. For further details, see application note AN0017.
Ref: DSCHX3068-QDG8144 - 23 May 08
6/8
Specifications subject to change without notice
Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
15-30GHz Frequency Multiplier
CHX3068-QDG
the 24L-QFN4x4 products
Proposed Assembly characterization.
-
board
for
-
Compatible with the proposed foot print. Based on typically RO4003 / 8mils or equivalent. Using a microstrip to coplanar transition to access the package. Recommended for the implementation of this product on a module board.
Capacitor 10nF 10%
Biasing : -Vd0=Vd1,2=Vd3=Vd4=4V -Adjust Vg to achieve Id4=115mA typically Vg=-1.8V) Id0+Id1,2+Id3+Id4 270mA
Ref. DSCHX3068-QDG8144 - 23 May 08
7/8
Specifications subject to change without notice
Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
CHX3068-QDG
Evaluation mother board:
15-30GHz Frequency Multiplier
Compatible with the proposed footprint. Based on typically Ro4003 / 8mils or equivalent. Using a microstrip to coplanar transition to access the package. Recommended for the implementation of this product on a module board. Decoupling capacitors of 10nF 10% are recommended for all DC accesses. (See application note AN0017 for details).
Ordering Information
QFN 4x4 RoHS compliant package: PART-CHX3068/XY Stick: XY = 20 Tape & reel: XY = 21
Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S.
Ref: DSCHX3068-QDG8144 - 23 May 08 8/8 Specifications subject to change without notice
Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09

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